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Company · founded 2012

National Center for Advanced Packaging (China)

Wuxi, China · ncap-cn.com/en

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Citations, last 5 years: 84
Works, last 5 years: 21
h-index: 40
Scientists listed: 3
Grants since 2016: 0

Strongest research topics

3D IC and TSV technologies173Engineering
Electronic Packaging and Soldering Technologies126Engineering
Microwave Engineering and Waveguides55Engineering
Copper Interconnects and Reliability36Materials Science
VLSI and Analog Circuit Testing34Computer Science
Silicon Carbide Semiconductor Technologies32Engineering

Most cited scientists, last five years

Fengman LiuNational Center for Advanced Packaging (China) · ChinaEngineering351citations, 5 yrs39works, 5 yrs13h-index Lijun ChenNational Center for Advanced Packaging (China) · ChinaEngineering41citations, 5 yrs5works, 5 yrs5h-index Fengwei DaiNational Center for Advanced Packaging (China) · ChinaEngineering24citations, 5 yrs14works, 5 yrs8h-index